Advanced chip packaging

A chip package is the housing that connects silicon to the rest of a system. Advanced packaging goes further: instead of one die per package, it stacks or tiles multiple dies — memory next to compute, different process nodes side by side — and wires them together with short, dense interconnects rather than slow board traces. The payoff is bandwidth and latency that a single monolithic die, or discrete chips on a PCB, cannot match. The hard part is yield and heat: the more silicon in one package, the more ways it can fail, and the harder it is to cool. TSMC's CoWoS process holds a near-monopoly on the most capable form of this for AI accelerators.